描述
無描述配置
Nitrogen batch ovenOEM 代工型號說明
The BT301 Batch Reflow Oven is a revolutionary new product that allows you to match your thermal process specifications for preheat, soak, reflow, and cooling on the first PCB you produce. It has the thermal conditions of an inline reflow system in a bench-top unit with a full dynamic thermal process. The use of nitrogen for lead-free assembly in the reflow process improves solder joint strength and reduces oxidation. The BT301N is ideal for product development, prototyping, and small series production. Solder profiles are easily set up and stored through the control app of the BT301N’s exclusive hardware control on an Android operating system. The dynamic control system takes care of the size and complexity of your assembly and makes it a closed-loop process, something only large and costly thermal systems can normally offer. This makes the BT301N a great choice for those looking for an efficient and cost-effective solution for their PCB production needs.文檔
無文檔
AUTOTRONIK
BT301N
已驗證
類別
Reflow Oven
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44428
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AUTOTRONIK
BT301N
類別
Reflow Oven
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
44428
晶圓尺寸:
未知
年份:
2018
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Nitrogen batch ovenOEM 代工型號說明
The BT301 Batch Reflow Oven is a revolutionary new product that allows you to match your thermal process specifications for preheat, soak, reflow, and cooling on the first PCB you produce. It has the thermal conditions of an inline reflow system in a bench-top unit with a full dynamic thermal process. The use of nitrogen for lead-free assembly in the reflow process improves solder joint strength and reduces oxidation. The BT301N is ideal for product development, prototyping, and small series production. Solder profiles are easily set up and stored through the control app of the BT301N’s exclusive hardware control on an Android operating system. The dynamic control system takes care of the size and complexity of your assembly and makes it a closed-loop process, something only large and costly thermal systems can normally offer. This makes the BT301N a great choice for those looking for an efficient and cost-effective solution for their PCB production needs.文檔
無文檔