描述
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.配置
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 代工型號說明
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ULVAC
SME-200J
已驗證
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
110833
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULVAC
SME-200J
類別
PVD / Sputtering
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
110833
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.配置
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM 代工型號說明
未提供文檔
無文檔