描述
無描述配置
- PVD (2), Etch Chamber (1) - Loadlock Chambers (2) - Transfer Chamber (1) - Some broken parts, TMP for Lordlock and Transfer chamber Configuration(upper floor) - 2 L/L(VCB), - 1 Transfer Chamber, - 2 Depo(Sputter) - 1 Etch(HSE), - 3 Controller Raack - (AC Power, DC power Supply Vacuum Cont, Controller) Down Floor - 2 Cryo Compressor(CTI 9600), - 4 Dry Pump(SDE90), - 2 Chiller - 470VAC Transformer Failure - L/L(VCB) Contrtoller - VCB Bà: Door Close failure and Switching from Rough to Turbo - Etch CH(HSE)Controller: Switch to Depo A - ESC for Depo A does not work but new spare ESC availableOEM 代工型號說明
The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.文檔
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KLA / SPTS
SIGMA fxP
已驗證
類別
PVD / Sputtering
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
84170
晶圓尺寸:
6"/150mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部KLA / SPTS
SIGMA fxP
類別
PVD / Sputtering
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
84170
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
- PVD (2), Etch Chamber (1) - Loadlock Chambers (2) - Transfer Chamber (1) - Some broken parts, TMP for Lordlock and Transfer chamber Configuration(upper floor) - 2 L/L(VCB), - 1 Transfer Chamber, - 2 Depo(Sputter) - 1 Etch(HSE), - 3 Controller Raack - (AC Power, DC power Supply Vacuum Cont, Controller) Down Floor - 2 Cryo Compressor(CTI 9600), - 4 Dry Pump(SDE90), - 2 Chiller - 470VAC Transformer Failure - L/L(VCB) Contrtoller - VCB Bà: Door Close failure and Switching from Rough to Turbo - Etch CH(HSE)Controller: Switch to Depo A - ESC for Depo A does not work but new spare ESC availableOEM 代工型號說明
The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.文檔
無文檔