描述
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller配置
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 代工型號說明
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.文檔
無文檔
類別
PVD / Sputtering
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
143506
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
ENDURA SL PVD
類別
PVD / Sputtering
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
143506
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Missing Parts: Mg Rotation Assembly, DC Cable, RF Cable, ESC, Sputter DC Power Supply, Dry Pump, BEC Terminal, Mg Motor, Magnet, Lift Cylinder Set, Matching Box,RF power supply, turbo controller配置
Sputter ETCH × 2 channels, SIP-Ti × 3 channelsOEM 代工型號說明
Applied Materials, Inc.SL has been introduced, a new generation of Applied Materials, Inc.PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands the family of products to provide customers with a complete offering of PVD solutions. The system, which is available with several PVD aluminum and barrier layer process chambers, uses two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. The system is designed to conform to the latest communications and facility standards, and is available with factory automation capability.文檔
無文檔