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TEL / TOKYO ELECTRON TRIASe+ W
    描述
    MOCVD
    配置
    Triase+ SFD-W
    OEM 代工型號說明
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
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    TEL / TOKYO ELECTRON

    TRIASe+ W

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    已驗證

    類別

    CVD (Metalization)
    上次驗證: 超過60天前
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    條件:

    Used


    作業狀態:

    未知


    產品編號:

    62724


    晶圓尺寸:

    12"/300mm


    年份:

    未知

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    TEL / TOKYO ELECTRON

    TRIASe+ W

    verified-listing-icon

    已驗證

    類別

    CVD (Metalization)
    上次驗證: 超過60天前
    listing-photo-91f48ba1afa6449987f29f0701a707bd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    62724


    晶圓尺寸:

    12"/300mm


    年份:

    未知


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    MOCVD
    配置
    Triase+ SFD-W
    OEM 代工型號說明
    Triase+™ W is a 300mm single-wafer CVD system that delivers high step coverage tungsten (W) film deposition using WF6. By combining rapid heat up and cool down of wafer temperatures and with plasma-less chamber cleaning technology, the system achieves higher productivity and lower CoO. Utilizing SFD and CVD methods respectively, the Triase+™ W provides in-situ deposition of both nucleation and bulk film. This ensures high step coverage, even with small geometry, contact holes. The system is also capable of depositing low-resistance film to meet further scaling needs, and is suitable for such applications as contact plug formation and via filling.
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    無文檔

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