概述

The EG6000: Developed in 2004 and introduced in January 2005, the new EG6000 300mm probing system from Electroglas fuses advanced automation with the highest caliber of prober technology. Representing a major advancement in prober design and automation, the system is the only 300mm prober that employs precision direct-drive technology to enable it to achieve the highest positioning accuracy currently available. Simultaneously, the prober can deliver the fastest throughput obtainable as measured from lot-start to lot-end. Designed for advanced applications such as copper and low k dielectrics, the system employs a proprietary stage and control technology to enable highly accurate positioning of the test devices while moving devices into contact with the probes for test. MicroTouch adds the ability to control the impact forces while probing on delicate devices. The EG6000 features the new Advanced Vision System for better accuracy, robustness and speed in aligning devices to the probe card for test. It also features a sophisticated system for automatically measuring and compensating for thermal changes in the system components while testing at hot or cold temperatures. The EG6000 is based on the same core architecture as the prior 5|300 prober which served the relatively small market for parametric test and process development applications. The EG6000 features a broader range of application capabilities as well as many refinements and improvements in accuracy, throughput, automation, and reliability. This allows the EG6000 to address customer’s needs for high volume production wafer test that forms the large majority of the 300mm prober market.