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UF300A
類別
Probers概述
The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.
活躍中的上架商品
1
服務
檢驗、保險、評估、物流
