描述
無描述配置
Equipped with the following chuck type and options: ATT B300T (for FP3000 vacuum-base / ambient chuck type) -For 8” & 12” -Nicle coating (matt) -Plain multi-hole vacuum layout -Max. 500V (standard) -NO temperature control (ambient only) Additional Notes - This is a “special chuck design” with 3 additional temperature sensors that are routed to the outside (to the measuring device) - not a standard - The chuck currently has no controller and can therefore only be operated “ambient” (i.e. without temperature control).OEM 代工型號說明
The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.文檔
無文檔
類別
Probers
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
124105
晶圓尺寸:
未知
年份:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
FP3000
類別
Probers
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
124105
晶圓尺寸:
未知
年份:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Equipped with the following chuck type and options: ATT B300T (for FP3000 vacuum-base / ambient chuck type) -For 8” & 12” -Nicle coating (matt) -Plain multi-hole vacuum layout -Max. 500V (standard) -NO temperature control (ambient only) Additional Notes - This is a “special chuck design” with 3 additional temperature sensors that are routed to the outside (to the measuring device) - not a standard - The chuck currently has no controller and can therefore only be operated “ambient” (i.e. without temperature control).OEM 代工型號說明
The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.文檔
無文檔