描述
Fully automatic in-feed surface grinder/polisher配置
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM 代工型號說明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文檔
無文檔
DISCO
DGP8760
已驗證
類別
Polishing and Grinding
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
72740
晶圓尺寸:
6"/150mm
年份:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DGP8760
已驗證
類別
Polishing and Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
72740
晶圓尺寸:
6"/150mm
年份:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Fully automatic in-feed surface grinder/polisher配置
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM 代工型號說明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.文檔
無文檔