描述
無描述配置
DFM2700+8760OEM 代工型號說明
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.文檔
無文檔
DISCO
DFM2700
已驗證
類別
Polishing and Grinding
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79183
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFM2700
已驗證
類別
Polishing and Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79183
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
DFM2700+8760OEM 代工型號說明
The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.文檔
無文檔