描述
無描述配置
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM 代工型號說明
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.文檔
無文檔
ACCRETECH / TSK
PG300RM
已驗證
類別
Polishing and Grinding
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56213
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG300RM
已驗證
類別
Polishing and Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56213
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM 代工型號說明
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.文檔
無文檔