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描述
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION配置
無配置OEM 代工型號說明
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.文檔
無文檔
類別
Pick and Place
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63979
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ROYCE INSTRUMENTS
DE-35
類別
Pick and Place
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
63979
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTION配置
無配置OEM 代工型號說明
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.文檔
無文檔