描述
20 Misc. Feeders Included配置
11513 HoursOEM 代工型號說明
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.文檔
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PHILIPS / ASSEMBLEON
OPAL-XII
已驗證
類別
Pick and Place
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
54500
晶圓尺寸:
未知
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PHILIPS / ASSEMBLEON
OPAL-XII
類別
Pick and Place
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
54500
晶圓尺寸:
未知
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
20 Misc. Feeders Included配置
11513 HoursOEM 代工型號說明
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.文檔
無文檔