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描述
無描述配置
4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEM 代工型號說明
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.文檔
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PANASONIC
NPM-W2
類別
Pick and Place
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
94011
晶圓尺寸:
未知
年份:
2019
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
4 units with 16+16 spindle Heads 1 unit with 8+3 heads with tray unit includes feeder carts Placement Heads: Lightweight 16-nozzle head, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head. Applicable components: Chip 1608 a SOP, PLCC, QFP, conector, BGA, CSP Placement Max. Speed: 77000cph (0.047s/chip)OEM 代工型號說明
NPM-W2. Building upon the already impressive NPM-W capabilities, this advanced platform boasts a remarkable 10% throughput increase and a staggering 25% enhancement in accuracy, setting a new standard for efficiency and precision. The integration of the revolutionary Multi Recognition Camera elevates the assembly process to unparalleled heights, offering a seamless combination of 2D alignment, component thickness inspection, and 3D coplanarity measurement in a single, cutting-edge system. Embrace an expanded component range, ranging from the ultra-small 03015mm microchips to sizable components up to 120x90mm and connectors nearly 6 inches (150mm) long, standing up to 40mm tall. Unleash the full potential of electronics assembly with the NPM-W2, and experience the perfect fusion of innovation and performance.文檔
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