描述
Substrate Surface Mount (Passive Component, Boat) [oS]配置
無配置OEM 代工型號說明
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.文檔
無文檔
類別
Pick and Place
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
151384
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / SIEMENS
SIPLACE CA
類別
Pick and Place
上次驗證: 25 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
151384
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Substrate Surface Mount (Passive Component, Boat) [oS]配置
無配置OEM 代工型號說明
The SIPLACE CA (Chip Assembly) platform can place bare dies directly from wafers, using the die attach or flip chip process. It supports the entire SMT placement capabilities provided by the SIPLACE X Series. The SIPLACE CA can be used for direct die attach or SMD only or in mixed applications to place bare dies along with SMD components in a single pass process.文檔
無文檔