描述
Complete, Working Condition, with no missing parts. Last used Q1 2023配置
PECVD Gases: Ar - 500 sccm NH3 - 50 sccm 5%SiH4/N2 - 1000 sccm CF4 - 500 sccm O2 - 500 sccm N2O - 2000 sccm N2 - 2000 sccm CB1 - Main Circuit Breaker CB2 - PSU CB3 - Not Used CB4 - RF Generator CB5 - LF Generator CB6 - TEOS CB7 - Not Used CB8 - Foreline Heat CB9 - Table Heat CB10 - Chamber Heat CB11 - Pumpdown Heat CB12 - Chamber Pump CB13 - Loadlock Pump CB14 - Not UsedOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔
OXFORD
PLASMALAB 100
已驗證
類別
PECVD
上次驗證: 15 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
81699
晶圓尺寸:
未知
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
OXFORD
PLASMALAB 100
類別
PECVD
上次驗證: 15 天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
81699
晶圓尺寸:
未知
年份:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Complete, Working Condition, with no missing parts. Last used Q1 2023配置
PECVD Gases: Ar - 500 sccm NH3 - 50 sccm 5%SiH4/N2 - 1000 sccm CF4 - 500 sccm O2 - 500 sccm N2O - 2000 sccm N2 - 2000 sccm CB1 - Main Circuit Breaker CB2 - PSU CB3 - Not Used CB4 - RF Generator CB5 - LF Generator CB6 - TEOS CB7 - Not Used CB8 - Foreline Heat CB9 - Table Heat CB10 - Chamber Heat CB11 - Pumpdown Heat CB12 - Chamber Pump CB13 - Loadlock Pump CB14 - Not UsedOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔