描述
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet included配置
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of silane oxides and nitrides -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 400 degreesOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔
類別
PECVD
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
106186
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100 PECVD
類別
PECVD
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
106186
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
-Recently de-installed, but not operational (there is a wafer transport issue) -Full gas cabinet included配置
Oxford Plasmalab 100 PECVD: -Configured for 200mm wafers, with Al carrier for multiple substrate sizes, down to small pieces -Used for deposition of silane oxides and nitrides -Optional low-frequency power supply (configured with dual-frequency RF) -Heated stage; Routinely ran at 400 degreesOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔