描述
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PECVDOEM 代工型號說明
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文檔
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OXFORD
PLASMALAB 80 PLUS
已驗證
類別
PECVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
64017
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 80 PLUS
類別
PECVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
64017
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
PECVDOEM 代工型號說明
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文檔
無文檔