描述
functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but can do 6” Deposits SiO2 & SiH4 @ 300C All MFCs for above processes are operational bar the Silane one Is an OIPT tool but has bespoke software. Built 1995, software upgrade 2010 No burner gas abatement Control PC Edwards E2M80 vacuum pump Rf Generator配置
PECVD 80+ SiO2 DepOEM 代工型號說明
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文檔
無文檔
類別
Etch/Asher
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
126422
晶圓尺寸:
4"/100mm, 6"/150mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 80 PLUS
類別
Etch/Asher
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
126422
晶圓尺寸:
4"/100mm, 6"/150mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
functional tool but can be repaired (requires Silane MFC) Designed for 4” wafers but can do 6” Deposits SiO2 & SiH4 @ 300C All MFCs for above processes are operational bar the Silane one Is an OIPT tool but has bespoke software. Built 1995, software upgrade 2010 No burner gas abatement Control PC Edwards E2M80 vacuum pump Rf Generator配置
PECVD 80+ SiO2 DepOEM 代工型號說明
The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.文檔
無文檔