Optional Accessories:

- Edwards iGX100N Pump

- Alcatel ATH 1600M Pump

Known Problems:

- The roughing valve for the main chamber is leaking. This is a recent issue

and it has not been addressed yet as the chamber vacuum is still reasonable

for etch processes (around 10E-6 Torr).

- Heating for the pump-down line is not operational due to a broken

controller. This does not affect the processes.

- The wafer transition to the system is not reliable and to address this we are

using 6 inch Al plates to fix our wafers and samples on. This is not optimal for

sample cooling but it works well for us and we currently do not experience

wafer mishandling.

- We currently operate the wide temperature electrode only at room

temperature as the system operation at other temperatures was unreliable

and presently we do not really need sample processing at other

temperatures.

Screen Recording 2021-02-16 at 1.28.44 PM 2.mov

OXFORD

The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces

PLASMALAB 100 PECVD

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OXFORD

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