描述
無描述配置
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔
OXFORD
PLASMALAB 100
已驗證
類別
PECVD
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116992
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100
類別
PECVD
上次驗證: 昨日
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116992
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
· One Machine with 2 Process Modules and one Square LoadLock in between, · Left Chamber: PECVD (No turbo). · Right Chamber ICP/RIE (with Turbo) and ENDPOINT DETECTOR(LASER),1 Quartz Clamp 6" · LoadLock- Square with rotating arm · PC Computer with Oxford Software Version-PC2000 · All Mechanical Pumps are Oil pump. (3 Pumps) · One Chiller attached to ICP/RIE · 2 Gas Pods: PECVD- SiH4 (silane) N2O NH3 (ammonia) ICP/RIE- C4F8 O2 HeOEM 代工型號說明
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces文檔
無文檔