描述
無描述配置
Chemical Vapour Depositioning (CVD - Single)OEM 代工型號說明
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.文檔
無文檔
類別
PECVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129800
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LAM RESEARCH / NOVELLUS
VECTOR Q STRATA
類別
PECVD
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
129800
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Chemical Vapour Depositioning (CVD - Single)OEM 代工型號說明
VECTOR Q Strata is a product in the VECTOR family of Lam Research Corporation. It is designed to provide the performance and flexibility needed to create enabling structures and meet the demands of challenging applications in the semiconductor industry. The VECTOR family uses Plasma-Enhanced Chemical Vapor Deposition (PECVD) and Plasma-Enhanced Atomic Layer Deposition (ALD) technologies to deposit high-quality dielectric films that meet exacting thickness, feature coverage, and stress, electrical, and mechanical requirements. The VECTOR Q Strata offers superior thin film quality, exceptional wafer-to-wafer uniformity, best-in-class productivity, low cost of ownership, and broad process flexibility enabled by Multi-Station Sequential Deposition (MSSD) architecture. It also features proprietary technology for controlling wafer heat-up independent of film deposition, improving film quality and reducing processing time.文檔
無文檔