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The Centura 5200 DXZ is used for advanced 150mm and 200mm CVD technology in the advanced CMOS and MtM segments. It can be used for ultra-thick oxides (≥20µm), low-temperature processing (<200°C), conformal, low wet-etch-rate films, and doped films with tunable refractive indices. The system can handle a variety of MtM substrates (including SiC wafers) reliably and carefully from load lock wafer mapping to clear wafer orientation to wafer placement.
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