描述
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air配置
Singulation Process 3016ATOEM 代工型號說明
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.文檔
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LARSEN
WAND
已驗證
類別
PCB / SMT
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59322
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LARSEN
WAND
類別
PCB / SMT
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
59322
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air配置
Singulation Process 3016ATOEM 代工型號說明
As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.文檔
無文檔