描述
無描述配置
ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM 代工型號說明
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ATV TECHNOLOGY
SRO 704
已驗證
類別
PCB / SMT
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17653
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ATV TECHNOLOGY
SRO 704
已驗證
類別
PCB / SMT
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17653
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM 代工型號說明
未提供文檔
無文檔