描述
無描述配置
De-taper, 4"-8" Wafer thickness: 300 - 1000 um Power supply: 110 V.OEM 代工型號說明
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文檔
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類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65691
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NITTO
HR 8500 II
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65691
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
De-taper, 4"-8" Wafer thickness: 300 - 1000 um Power supply: 110 V.OEM 代工型號說明
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option文檔
無文檔