描述
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocks配置
無配置OEM 代工型號說明
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.文檔
無文檔
類別
Packaging
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150299
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LINTEC
RAD-3500 F/12
類別
Packaging
上次驗證: 2 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
150299
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Silicon wafers, apply back grinding protective tape (BG Tape) to the front side of the wafer before the back grinding (BG) process. Function of polishing tape: Protects the front circuitry during wafer thinning and polishing, prevents chipping, and blocks配置
無配置OEM 代工型號說明
LINTEC RAD-3500 F/12 is a Packaging system. The RAD-3500 F/12 can produce wafer size of 12”.文檔
無文檔