We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
Current status: In production No missing parts. No repairs required.配置
無配置OEM 代工型號說明
Introducing the RAD-3010 F/12 Fully-Automatic BG Tape Remover: the pinnacle of precision and efficiency for single wafer processing. With UV alignment, heat seal technology, and a built-in heater, this cutting-edge equipment ensures seamless tape removal and superior wafer quality. Experience unmatched reliability and productivity with the RAD-3010 F12文檔
無文檔
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101582
晶圓尺寸:
8"/200mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
LINTEC
RAD-3010 F/12
類別
Packaging
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101582
晶圓尺寸:
8"/200mm
年份:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Current status: In production No missing parts. No repairs required.配置
無配置OEM 代工型號說明
Introducing the RAD-3010 F/12 Fully-Automatic BG Tape Remover: the pinnacle of precision and efficiency for single wafer processing. With UV alignment, heat seal technology, and a built-in heater, this cutting-edge equipment ensures seamless tape removal and superior wafer quality. Experience unmatched reliability and productivity with the RAD-3010 F12文檔
無文檔