描述
Flip Chip Bond/Reflow (TCB) [oS]配置
無配置OEM 代工型號說明
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.文檔
無文檔
ASMPT
NUCLEUS
類別
Packaging
上次驗證: 23 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
151389
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Flip Chip Bond/Reflow (TCB) [oS]配置
無配置OEM 代工型號說明
Multi-Purposes Precision Pick & Place Tool The NUCLEUS is one of the ASMPT’s latest advanced packaging solutions for precision placement. It is designed to address different fan-out assembly approaches such as die-up or die-down with local and/or global alignment modes. The NUCLEUS is capable of fully automated multi-die bond processing with its large work holder for 12” wafer substrate and up to 330 x 330mm panel substrate, making it ideal for wafer level packaging and panel level packaging. Apart from high throughput, the NUCLEUS also provides high bonding accuracy with a XY placement accuracy of less than 2.5µm at 3σ. The NUCLEUS comes with an optional feature which provides an additional processing capability for high bond force and bond temperature catering to a specific process requirement of high-end device application.文檔
無文檔