描述
無描述配置
無配置OEM 代工型號說明
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.文檔
無文檔
類別
Packaging
上次驗證: 19 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
146071
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASMPT / DEK
SUNBIRD
類別
Packaging
上次驗證: 19 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
146071
晶圓尺寸:
未知
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
sophisticated system providing total solution on sorting, six-side inspection and flexibility for an individual unit testing and laser marking. Applications include wafer level packages / dice inspection comprising micro crack inspection at six sides and sorting according to wafer mapping generated from the upstream processes.文檔
無文檔