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TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP
    描述
    TSV Cu Anneal
    配置
    TSV Cu Anneal
    OEM 代工型號說明
    The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
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    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

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    已驗證

    類別
    Oven

    上次驗證: 超過30天前

    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    75747

    晶圓尺寸:

    12"/300mm

    年份:

    2000

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    TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    Oven
    年份: 2000條件: 二手
    上次驗證超過30天前

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    verified-listing-icon
    已驗證
    類別
    Oven
    上次驗證: 超過30天前
    listing-photo-6cf9cd72db9a4e94bd14717229845f51-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/6cf9cd72db9a4e94bd14717229845f51/5078fa0e3a40478d92d8eaaeeb738e5a_fileutil_mw.jpg
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    關鍵商品詳情
    條件:

    Used

    作業狀態:

    未知

    產品編號:

    75747

    晶圓尺寸:

    12"/300mm

    年份:

    2000

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    TSV Cu Anneal
    配置
    TSV Cu Anneal
    OEM 代工型號說明
    The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
    文檔

    無文檔

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    查看全部
    TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    Oven年份: 2000條件: 二手上次驗證: 超過30天前