描述
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensor配置
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM 代工型號說明
未提供文檔
無文檔
類別
Metrology
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
147462
晶圓尺寸:
8"/200mm
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
UNITY SEMICONDUCTOR / HSEB
Lightspeed
類別
Metrology
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
147462
晶圓尺寸:
8"/200mm
年份:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensor配置
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM 代工型號說明
未提供文檔
無文檔