描述
無描述配置
Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance freeOEM 代工型號說明
SEM / TEM / FIB文檔
無文檔
FOGALE Nanotech
DEEPROBE 300-M
已驗證
類別
Metrology
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65311
晶圓尺寸:
未知
年份:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FOGALE Nanotech
DEEPROBE 300-M
類別
Metrology
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
65311
晶圓尺寸:
未知
年份:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance freeOEM 代工型號說明
SEM / TEM / FIB文檔
無文檔