描述

Back Side Implant Details Attached

配置

Cassette Interface: 2 Asyst Bolt-on SMIF Cassette Stages Automatic Flat / Notch Alignment Programmable Flat Orient Wafer Rotation Energy Range: 0-250 keV Programmable Auto Tilt:0 -75° Single Stage Extraction: 15-40 keV Ion Source Type: ELS Source Material Type: Moly Energy Filter System Option Parallel Beam Using Hybrid Scanning Electrostatic Chuck (ESC) ESX Angle Correction 90° Radially Indexed Dipole Magnet Signal Tower SECS II / GEM Interface Controller SunSparc Station V Application SW Ver: 4.3.2 Auto Start up & computer monitoring Pumps//Cryogenics Source Pump: TMP Beam Pump: TMP 2 Beam Up: Cryo-Pump (8' Torr, non On-Board) End Station Pump: 2 Cryo Pump 8' Torr, non On-Board) Cryo Compressor: CTI 8500 Remote Disk Chiller Gas Configuration: AsH3-SDS PH3 - SDS BF3 - SDS AR-HP Power Requirements: V 208, A100, Phase 3/5 Wire, Freq 50/60Hz

OEM 代工型號說明

Axcelis Technologies' 8250 medium current line uses an ultra-pure, parallel beam design enhanced by extremely precise wafer positioning, enabling the minute detailing of transistors. The 8250 provides the advanced process capabilities necessary for medium current implants. Incorporating several key productivity enhancements in its design, it offers enhanced yield and serial processing advantages. This system is a fully automated, 200mm, serial processing system designed to maximize productivity and minimize all forms of contamination. Production-proven beam optics and wafer position control deliver pure, parallel and repeatable beams. The 8250 is the industry's only medium current system to incorporate a final energy filter, ensuring maximum beam purity over the entire energy range of multiply-charged species up to 750keV. New features such as the extended life source (ELS), electrostatic chuck, fully integrated statistical process control (SPC), and slit load lock process chamber allow the 8250 to provide superior processing capability at the lowest cost of ownership.