描述
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton配置
無配置OEM 代工型號說明
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.文檔
無文檔
類別
Mask/Bond Aligners
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
136205
晶圓尺寸:
8"/200mm
年份:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA300 Plus
類別
Mask/Bond Aligners
上次驗證: 14 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
136205
晶圓尺寸:
8"/200mm
年份:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: All internal parts are damaged, leaving only the skeleton配置
無配置OEM 代工型號說明
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.文檔
無文檔