描述
無描述配置
無配置OEM 代工型號說明
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文檔
無文檔
SUSS MicroTec / KARL SUSS
BA8
已驗證
類別
Mask/Bond Aligners
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116415
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
BA8
類別
Mask/Bond Aligners
上次驗證: 12 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116415
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder文檔
無文檔