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描述
Exposure配置
無配置OEM 代工型號說明
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."文檔
無文檔
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
82020
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
IQ ALIGNER
類別
Mask/Bond Aligners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
82020
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Exposure配置
無配置OEM 代工型號說明
"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy. Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."文檔
無文檔