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VEECO / ULTRATECH AP300
    描述
    C4 EXPOSE, WIDEFIELD
    配置
    無配置
    OEM 代工型號說明
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    文檔

    無文檔

    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    已驗證

    類別
    Lithography

    上次驗證: 28 天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    73807


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography
    年份: 2006條件: 二手
    上次驗證超過30天前

    VEECO / ULTRATECH

    AP300

    verified-listing-icon
    已驗證
    類別
    Lithography
    上次驗證: 28 天前
    listing-photo-b6ea188f4e9f499b8e1cec095b8bc30d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    73807


    晶圓尺寸:

    未知


    年份:

    未知


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    C4 EXPOSE, WIDEFIELD
    配置
    無配置
    OEM 代工型號說明
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    文檔

    無文檔

    類似上架商品
    查看全部
    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography年份: 2006條件: 二手上次驗證:超過30天前
    VEECO / ULTRATECH AP300

    VEECO / ULTRATECH

    AP300

    Lithography年份: 0條件: 二手上次驗證:28 天前