描述
Installed and operating. The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. The system's 40-nm address grid allows for detailed exposure work, reaching image resolutions of over 500,000 dots per inch, making it ideal for high-precision applications on chrome masks and semiconductor wafers.配置
442 nm wavelength HeCd laserOEM 代工型號說明
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.文檔
無文檔
HEIDELBERG INSTRUMENTS
DWL 66
已驗證
類別
Lithography
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115928
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
HEIDELBERG INSTRUMENTS
DWL 66
類別
Lithography
上次驗證: 5 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115928
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Installed and operating. The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. The system's 40-nm address grid allows for detailed exposure work, reaching image resolutions of over 500,000 dots per inch, making it ideal for high-precision applications on chrome masks and semiconductor wafers.配置
442 nm wavelength HeCd laserOEM 代工型號說明
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.文檔
無文檔