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描述
無描述配置
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 代工型號說明
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option文檔
無文檔
ESI
9820
類別
Laser
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
105420
晶圓尺寸:
6"/150mm, 8"/200mm, 12"/300mm
年份:
未知
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描述
無描述配置
Minimum Spot Size (1/e2): 2.0μm Accuracy: .20μm Wavelength: 1.3μm – LightWave Laser rep rate: 30kHz Maximum cut velocity: 200mm/second Wafer Diameter 200mm / 300mm.(S‐type for 150mm)OEM 代工型號說明
The Model 9820 is based on ESI’s highly successful 98XX platform, which was developed specifically for advanced DRAM, SRAM, embedded memory and other laser fuse applications. The 9820 offers a wide process window, and small spot sizes to address the requirements of most high-speed chips. The large-field 98XX platform minimizes alignment, stepping and other overhead factors that impact throughput, while auto-adjusting optics keep optical components perfectly aligned for optimal process performance and highest productivity. Capable of processing new generations of tight pitch fuses Designed for high volume, automated 300 mm production Wide range of processing applications – Poly Si, Al, and Cu capable New high-performance laser option文檔
無文檔