描述
Multi-Process CMP配置
無配置OEM 代工型號說明
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.文檔
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STRASBAUGH
6DS-SP
已驗證
類別
Lapping, Polishing, Grinding
上次驗證: 28 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56716
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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STRASBAUGH
6DS-SP
類別
Lapping, Polishing, Grinding
上次驗證: 28 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
56716
晶圓尺寸:
8"/200mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Multi-Process CMP配置
無配置OEM 代工型號說明
6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.文檔
無文檔