描述
Wafer Backside Grinder配置
無配置OEM 代工型號說明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文檔
無文檔
DISCO
DGP8761
已驗證
類別
Lapping, Polishing, Grinding
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116266
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DGP8761
類別
Lapping, Polishing, Grinding
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116266
晶圓尺寸:
8"/200mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Backside Grinder配置
無配置OEM 代工型號說明
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.文檔
無文檔