描述
Conditions: can be powered on.配置
無配置OEM 代工型號說明
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.文檔
無文檔
ACCRETECH / TOSEI
W-GM-4250
已驗證
類別
Wafer Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113429
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
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ACCRETECH / TOSEI
W-GM-4250
類別
Wafer Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
113429
晶圓尺寸:
未知
年份:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Conditions: can be powered on.配置
無配置OEM 代工型號說明
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.文檔
無文檔