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交易市集 > Wafer Grinding > ACCRETECH / TOSEI
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ACCRETECH / TOSEI

概述

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines* Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*

活躍中的上架商品

7

全部產品

12

服務

檢驗、保險、評估、物流

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