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VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
  • VEECO RF-350
描述
Tool capable of Pt, Au, Ta, Ti, Al, TiW, oxide/ nitride dielectric etching Etch rate of >500A/ min 200 mm Wafer size , Variable wafer thickness (of 300 um to 1200 um) . SECS/ GEM communication Tool Must have e-beam neutralizer ( to avoid surface charging) Tool must have N2, He, Ar, MFC, (O2 MFC if reactive + Ion beam etching is available) Tilt and rotation control of substrate ( Sub Holder) Etch Non-uniformity of 3% or better ( expected 2%)-1 Sig Excellent chuck cooling ( Helium cooling preferred), no resist burning Multi stage cryo, or Turbo pump for chamber pump down, capable of pumping down to 1 X 10E-7 or lower Load lock process and automated handler - Single End point detection ( Optical or SIMS, nice to have)-Optional
配置
無配置
OEM 代工型號說明
The RF-350 is an automatic, single-substrate, loadlocked production system that uses a 300mm diameter, inductively coupled ion source for large substrates. It is similar to the RF-210 in that it provides excellent uniformity from its inductively-coupled, highly-collimated, filamentless, RF ion source during RIBE or ion milling. The RF-350 offers maximized process flexibility due to its reactive gas capabilities and independent control of ion beam parameters and ion incident angle. Additionally, its modular design allows for a seamless and cost-effective upgrade from single substrate, loadlock processing to cassette-to-cassette loading. This makes the RF-350 a versatile and efficient tool for substrate processing.
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已驗證

類別
Ion Milling

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

Installed / Running


產品編號:

111937


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

VEECO

RF-350

verified-listing-icon
已驗證
類別
Ion Milling
上次驗證: 超過60天前
listing-photo-1f9aea6de1f24243aed777889dbff8a4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53853/1f9aea6de1f24243aed777889dbff8a4/29e38a2bf6144fc1a142bdca2de0ffe7_a9858afe9f1f45e8bc824684e8eb61f4_mw.jpeg
listing-photo-1f9aea6de1f24243aed777889dbff8a4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53853/1f9aea6de1f24243aed777889dbff8a4/4b0d217ff2b0416a82c4cc8ef3b08112_photonov062024105237am_mw.jpg
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listing-photo-1f9aea6de1f24243aed777889dbff8a4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53853/1f9aea6de1f24243aed777889dbff8a4/60900e5b71cc4e6baec708d57524f686_photonov062024105321am_mw.jpg
listing-photo-1f9aea6de1f24243aed777889dbff8a4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53853/1f9aea6de1f24243aed777889dbff8a4/34da070990704006a7c56ded835d4777_photonov062024105403am_mw.jpg
listing-photo-1f9aea6de1f24243aed777889dbff8a4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53853/1f9aea6de1f24243aed777889dbff8a4/455f0ff05a29492ba3a98fa6a21efae7_photonov062024105211am_mw.jpg
關鍵商品詳情

條件:

Used


作業狀態:

Installed / Running


產品編號:

111937


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tool capable of Pt, Au, Ta, Ti, Al, TiW, oxide/ nitride dielectric etching Etch rate of >500A/ min 200 mm Wafer size , Variable wafer thickness (of 300 um to 1200 um) . SECS/ GEM communication Tool Must have e-beam neutralizer ( to avoid surface charging) Tool must have N2, He, Ar, MFC, (O2 MFC if reactive + Ion beam etching is available) Tilt and rotation control of substrate ( Sub Holder) Etch Non-uniformity of 3% or better ( expected 2%)-1 Sig Excellent chuck cooling ( Helium cooling preferred), no resist burning Multi stage cryo, or Turbo pump for chamber pump down, capable of pumping down to 1 X 10E-7 or lower Load lock process and automated handler - Single End point detection ( Optical or SIMS, nice to have)-Optional
配置
無配置
OEM 代工型號說明
The RF-350 is an automatic, single-substrate, loadlocked production system that uses a 300mm diameter, inductively coupled ion source for large substrates. It is similar to the RF-210 in that it provides excellent uniformity from its inductively-coupled, highly-collimated, filamentless, RF ion source during RIBE or ion milling. The RF-350 offers maximized process flexibility due to its reactive gas capabilities and independent control of ion beam parameters and ion incident angle. Additionally, its modular design allows for a seamless and cost-effective upgrade from single substrate, loadlock processing to cassette-to-cassette loading. This makes the RF-350 a versatile and efficient tool for substrate processing.
文檔

無文檔