Canon Inc. is the world’s largest camera manufacturer with a history spanning over 80 years, during which time they have made some of the most important innovations within both photographic and video technology.

The CANON FPA 2000-i1 is an advanced i-line wafer stepper that can print high-density VLSI devices with high yields. It has a printing wavelength of 365 nm, can handle wafers up to 4" in size, and has a resolution of 0.5 µm. It also features die-by-die and global leveling for wafer leveling.

CANON

 FPA-2000i1

The CANON FPA-2500i2 is a stepper system that can be used with a 6” reticle wafer size. It has a numerical aperture of 0.54 / 0.45 and an image field of 22 mm [(X)17mm x (Y)26mm]. The CANON FPA-2500i2 stepper has a printing wavelength of i-line (365 nm) and a resolution of 0.45 μm. It has an illumination lamp of 1.5 kW super-high-pressure mercury and an illumination uniformity of ≤ 1.2 %. It also has alignment modes of TTL Off-Axis He-Ne TV and TTL Off-Axis Broad Band TV with an alignment light source of He-Ne laser (633 nm) and Halogen lamp. Its alignment accuracy is ≤ 0.1 μm (mean + 3 σ) and its throughput is ≥ 52 wafers / hour (8”, 60 shot).

FPA-2500i2

The Canon FPA-3000 i4 is a stepper used in the semiconductor industry. It has a reticle size of 6" square with a thickness of 0.25" and is made of quartz material1. It can handle wafer sizes of 4" through 8" that are SEMI Standard, JEIDA, Notch/Flat. The Canon FPA-3000 i4 has a projection magnification of 1/5 X and a numerical aperture of .45 - .63. The field size is 22x22 17x26 and the exposure light is Kr F (365nm). The estimated throughput of the Canon FPA-3000 i4 is 59 wafers per hour for an 8" wafer with 60 shots and 22 mm field size. For a 6" wafer, it can handle up to 83 wafers per hour with 32 shots and 22 mm field size. The Canon FPA-3000 i4 has an alignment accuracy of less than 0.06 μm (mean + 3 σ). The Canon FPA-3000 i4 has a resolution of 0.35 μm.

FPA-3000i4


FPA-2500i3 i-line stepper, 0.6 NA, 20mm x 20mm field, 44 wafers per hour, targeted at 64Mb DRAM
Numerical Aperture: 0.60 / 0.52 
Image Field: 20 mm [(X)11.14mm x (Y)26mm) 
Printing Wavelength: i-line (365 nm) 
Resolution:0.40μm
Illumination Lamp:	1.5 kW super-high-pressure mercury lamp
Illumination Uniformity:	< ±1.2 %
Current Wafer Size: 6”(4”, 5” and 8” Sizes Available) 
Magnification:	X 1/5 

FPA-2500i3

FPA-5500iZ	

FPA-5500iZ large-field i-line stepper for lowest CoO on non-critical layers. This high-productivity 365nm step-and-repeat system matches existing KrF/ArF scanner fields (26x33mm) for low-cost rough layer exposure.

FPA-5500iZ+

The FPA-3000iW is a high-throughput stepper from Canon that provides non-critical layer, 0.80µm level exposure at better than 110 wafers per hour. It has a one shot, 50 mm wide field exposure and is designed to decrease capital equipment Cost-of-Ownership. The FPA-3000iW has a small footprint, is easy to operate, and is compatible with Canon’s family of FPA-3000 steppers. It has a large field i-line lens with 0.8µm resolution accuracy and can expose four 22mm FPA-3000i4/i5/EX3 die areas in a single shot.

FPA-3000iW

Resolution: ≦ 500 nm
NA (Numerical Aperture): 0.37~0.28 (Variable)
Reduction Ratio1:2
Field Size: 52 mm (max) x 56 mm (max) (Φ70.7 mm inside)
Exposure Wavelength: i-line 365 nm
Reticle Size: 6 inch
Wafer Size: 200 mm (8 inch), 300 mm (12 inch) (Selection)

FPA-5510iX

CANON FPA 5000 IZA is a high throughput i-line stepper that delivers significant CoO advantages when exposing layers down to 350nm. This lithography system has overlay accuracy of 16nm through reticle magnification compensation and through improvements in Z and tilt compensation accuracy, stage environment control accuracy, and calibration accuracy. It delivers super productivity at 155wph (200mm wafers) or 93wph (300mm wafers) The CANON FPA 5000 IZA has a 4.5kW high-pressured mercury lamp.

FPA-5000iZa

The FPA-3000i5 is a Fine Pattern Aligner that can write submicron images on a silicon wafer. It has a 0.35 µm lithography and can process 74 wafers per hour. It has a 0.63 NA and uses the latest off-axis illumination technique (SIA II). The FPA-3000i5 has improved lens performance, better wafer edge chip auto-focusing, and increased illumination intensity. It has a small footprint and a multitasking touch screen operation. It is compatible with Canon’s family of lithography steppers.

FPA-3000i5

The FPA-3000i5+ is a high productivity mix-and-match partner with Canon excimer series scanners and steppers. Wide-field lens with extra NA variability supports a variety of fine patterning processes. This highly proven and successful veteran of the Canon stepper line-up has been a best-selling product since its release in 1996.

Features:
-Supports varieties of fine pattern demands. High resolution, wide-field lens, extra NA variability, plus reticle options.
-High alignment accuracy for CMP processes. Two off-axis methods in addition to Canon's original technology

FPA-3000i5+

Model type: i-Line (365nm) Stepper
Wafer size: 300mm; 200mm
Resolution: ≤0.50µm
Numerical Aperture (NA): 0.28 ~ 0.37
Reticle size: 6in. (0.25in. thick)
Reduction ratio: 2:1
Field size: 50mm x 50mm
Overlay accuracy: ≤ 60nm (M+3)
Throughput: ≥137wph (300mm); ≥160wph ( 200mm)

FPA-5500iX

FPA-1550 MARK IV-W

FPA-3000i6

Wafer Size: 300 mm, 200 mm
Resolution: ≤1.50 µm
Numerical Aperture (NA): 0.10 - 0.18
Reticle Size: 6 in. (0.25 in. thick)
Reduction Ratio: 2:1
Field Size: 52 mm x 34 mm
Overlay Accuracy: ≤300 nm (|m| + 3σ) frontside, ≤300 nm (|m| + 3σ) backside (option)

FPA-5510iV

FPA-3030i5++

FPA-5550iZ

The FPA-3030i5a can be equipped with a handling system that enables the selection of wafer diameters from 50mm (2inch) to 200mm (8inch) to support a variety of different compound semiconductor wafer sizes and materials.

FPA-3030i5a

The FPA-3030i5a is an i-Line Stepper from Canon that supports reduced Cost-of-Ownership manufacturing for small substrates. It supports a wide range of wafer sizes from 50mm (2inch) to 200mm (8inch) and is capable of imaging resolution below 0.35 microns while maintaining 40 nm overlay accuracy and high productivity. Canon developed the FPA-3030i5a to provide stable imaging, overlay and productivity for RF, Photonics, Sensor, Power, 5G Communication and MEMS applications.

FPA-3030i5

FPA-3000MR

FPA-3000iWa

Wafer Size: 300 mm (12 inch)
HR / LF / LF2 Options

FPA-5520iV

FPA-3000i5++

The FPA-3030iWa supports smaller substrates which are 200 mm or less in diameter.

FPA-3030iWa

FPA-8000iW

The FPA-5550iZ2 is a high productivity and high overlay accuracy i-line stepper made by Canon1. It offers a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication and also supports growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.

FPA-5550iZ2

The FPA-5510iZ is a high throughput 4X i-line stepper with a CoO advantage for exposing layers down to 280nm. It is compatible with both 200mm and 300mm DUV scanners.

Features include improved overlay and throughput performance through Canon's step-and-repeat know-how, reduced overlay accuracy to 20nm, enhanced focus and tilt compensation accuracy, temperature control, and auto-calibration functions. It also has a 4.5kW high-pressure Mercury Lamp, high transmittance optical system, dynamic aberration correction, fast wafer stage, and optimized wafer handling system for sustained high productivity (160wph for 200mm wafers and 100wph for 300mm wafers).

CANON

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最熱門的 CANON I-Line

FPA-2000i1

FPA-2500i2

FPA-3000i4

FPA-2500i3

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