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SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
  • SCIENTIFIC SEALING TECHNOLOGY / SST 3130
描述
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
配置
無配置
OEM 代工型號說明
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
文檔

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PREFERRED
 
SELLER
類別
Furnaces / Diffusion

上次驗證: 超過30天前

Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

124174


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

SCIENTIFIC SEALING TECHNOLOGY / SST

3130

verified-listing-icon
已驗證
類別
Furnaces / Diffusion
上次驗證: 超過30天前
listing-photo-25ba13e00d9c41fb8e3da34fff179d32-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

124174


晶圓尺寸:

未知


年份:

未知


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
500 DEG C, REBUILT VALVES AND VACUUM PUMP VACUUM BELOW 50 MILLITORR PRESSURES EXCEEDING 50 PSI
配置
無配置
OEM 代工型號說明
The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
文檔

無文檔