描述
無描述配置
Vacuum Soldering System Machine is not working for unknown reason.OEM 代工型號說明
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.文檔
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CENTROTHERM
VLO 300
已驗證
類別
Furnaces / Diffusion
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
54228
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CENTROTHERM
VLO 300
類別
Furnaces / Diffusion
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
54228
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Vacuum Soldering System Machine is not working for unknown reason.OEM 代工型號說明
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.文檔
無文檔