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描述
無描述配置
DIFFOEM 代工型號說明
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文檔
無文檔
類別
Furnaces / Diffusion
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107409
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
AVIZA / SVG / THERMCO
RVP-300plus
類別
Furnaces / Diffusion
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107409
晶圓尺寸:
12"/300mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
DIFFOEM 代工型號說明
For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm. RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.文檔
無文檔