描述
無描述配置
無配置OEM 代工型號說明
Flip Chip Bonder文檔
無文檔
SHINKAWA
COF 300
已驗證
類別
Flip Chip Bonders
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118797
晶圓尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SHINKAWA
COF 300
類別
Flip Chip Bonders
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118797
晶圓尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
Flip Chip Bonder文檔
無文檔